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Wafer Plating
A unique proprietary tool allows plating any wafer size from 75mm to 200mm with virtually any metal or alloy available in an aqueous solution. Prodigy Surface Tech is ideally suited for prototype and short production run wafer plating.
TYPICAL DEPOSITS
- Copper
- Nickel, Nickel/Palladium, Nickel/Cobalt
- Gold and Gold/Tin
- Silver
- Platinum
- Rhodium
- Magnetic Alloys
- Tin and Tin Alloys
- and Others
ADVANTAGES
- Low Process Drift
- Deposit Uniformity
- Low Material Usage
- Class 100 Clean Room Environment
- Quick Turnaround
- Analysis Laboratory
- Experienced Research Staff
Call or email for more information.
